| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability in junction between a terminal pad and solder by preventing cracks from being generated at the lower part of solder when a semiconductor device receives thermal stress. <P>SOLUTION: A metal ball 21 used for joining with an external component is provided on a first terminal pad 17 via a first solder layer 19. Then, the film thickness of the first solder layer 19 is set so as to position the metal ball 21, to a part where thermal stress is concentrated, namely at a part where the cracks of the first solder layer 19 are extended. <P>COPYRIGHT: (C)2008,JPO&INPIT |
