| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve reliability of surface acoustic wave (SAW) devices with an SAW element mounted by flip chip bonding and to prevent breaks of a piezoelectric substrate or an IDT electrode film especially in the proximity of a bump joint. <P>SOLUTION: The SAW device includes one or more SAW elements having an IDT electrode on the surface of a single crystal piezoelectric substrate and mounted by flip chip bonding on a base substrate through a metal bump. The IDT electrode is formed by laminated films containing a substrate layer composed of titanium nitride or titanium laminated on the single crystal piezoelectric substrate one by one and an Al layer, and the single crystal piezoelectric substrate is a lithium tantalate substrate with 46° or more rotation Y-X propagation. The single crystal piezoelectric substrate can be a lithium niobate substrate with 64° rotation Y-X propagation. <P>COPYRIGHT: (C)2008,JPO&INPIT |
