| 摘要 |
PROBLEM TO BE SOLVED: To provide a prober which is capable of safely and surely supporting a very thin semiconductor wafer that has a level difference between its peripheral edge and internal side. SOLUTION: The prober supports a semiconductor wafer 17, which is composed of a thick-walled peripheral edge 17A and a thin-walled internal part 17B, placed on a chuck 11 and carries out a test bringing its probe needle 7 into contact with the semiconductor wafer 17. The chuck 11 is composed of a periphery supporting part 12 which supports the peripheral edge 17A of the semiconductor wafer 17 bearing against it, an internal side supporting part 13 which has a level difference between itself and the periphery supporting part 12 to support the internal side 17B of the semiconductor wafer 17 bearing against it, and a moving mechanism 14 which shifts the periphery supporting part 12 and internal side supporting part 13 relatively so as to produce a level difference optional in height. COPYRIGHT: (C)2008,JPO&INPIT |
