| 摘要 |
PROBLEM TO BE SOLVED: To contact a soldering bit to the surface of a substrate in a constantly same state without using a limit switch, an actuator, or the like. SOLUTION: An ultrasonic soldering device 1 solders the surface of the substrate 2 with an ultrasonic vibration added to a solder 21 by contacting the bit of the ultrasonically vibrated soldering body 11 to the heat molten solder 21. The soldering body 11 is swingablly supported over the substrate 2, a biasing means 19 for biasing the swinging of the soldering body 11 so that the bit of the soldering body 11 is contacted to the surface of the substrate 2 is provided, and the bit of the soldering body 11 is contacted to the surface of the substrate 2 by the biasing of the biasing means 19 with the soldering body 11 inclined. COPYRIGHT: (C)2008,JPO&INPIT |
