| 摘要 |
PROBLEM TO BE SOLVED: To reduce a total length of all resistance elements on a layout while minimizing the number of boundaries between resistance elements and wiring parts having large variations in resistance-value change. SOLUTION: A semiconductor device has a resistance element part 13a, which is formed by electrically connecting a plurality of the resistance elements 13a-1, 13a-2 in series on a poly-Si film 13, a plurality of the wiring parts 13b, which are formed by implanting metal ions into each of a plurality of protruding parts 13-1-13-4 composed of a poly-Si film and extended at prescribed places in a direction of being branched in a flowing direction of a current passing through the resistance element part 13a, and a plurality of contact parts 16-1-16-4 respectively electrically connected to each of the wiring parts 13b. COPYRIGHT: (C)2008,JPO&INPIT
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