| 摘要 |
PROBLEM TO BE SOLVED: To provide a hybrid integrated circuit in which the packaging type and the circuit type of a hybrid integrated circuit can be selected and manufactured freely from one plastic molding die, and to provide its manufacturing process. SOLUTION: A substrate having a plurality of hybrid integrated circuits is plastic molded at once by transfer molding, its dividing position is selected arbitrarily and a substrate circuit is designed accordingly thus providing a hybrid integrated circuit in which the packaging type (SIP type, DIP type, SMD type, ZIP type) and the circuit type (one or a plurality of the same circuits or different circuits) of a hybrid integrated circuit can be selected freely from one plastic molding die. Its manufacturing process is also provided. COPYRIGHT: (C)2008,JPO&INPIT
|
