发明名称 EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin useful for an insulation material (highly reliable semiconductor-sealing material or the like) for electric and electronic material, various kinds of composite materials exemplified by a laminate (a printed wiring board, a built-up substrate or the like) and a CFRP, an adhesive, a coating material or the like, and having not only excellent flame retardancy but also excellent heat resistance and toughness. SOLUTION: The epoxy resin is obtained by reacting a polyfunctional epoxy resin obtained by glycidylating an alcoholic hydroxy group in an epoxy resin having the alcoholic hydroxy group, with a compound represented by formula (2). COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007284583(A) 申请公布日期 2007.11.01
申请号 JP20060114289 申请日期 2006.04.18
申请人 NIPPON KAYAKU CO LTD 发明人 NAKANISHI MASATAKA;OSHIMI KATSUHIKO;SUNAGA TAKAO
分类号 C08G59/14 主分类号 C08G59/14
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