| 摘要 |
PROBLEM TO BE SOLVED: To develop an amine curing-based epoxy resin having flux performances and corresponding to a no flow method because the amine curing-based epoxy resin using an aromatic amine as a curing agent has high adhesiveness to various kinds of substrates and thereby excellent durability in interfacial peeling of the substrates from chips, and packages having high reliability are obtained, to select a flux maintaining flux performances even in a high-temperature region of 240-270°C solder connection temperature according to a lead-free solder material and suitable for the amine curing-based epoxy resin and to provide a liquid epoxy resin composition. SOLUTION: The liquid epoxy resin composition comprises (A) a liquid epoxy resin, (B) an amine-based curing agent and (C) a reducing sugar in an amount of 0.1-20 pts.mass based on 100 pts.mass of the sum total of the components (A) and (B) and (D) an inorganic filler in an amount of 50-900 pts.mass based on 100 pts.mass of the epoxy resin of the component (A). COPYRIGHT: (C)2008,JPO&INPIT
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