发明名称 Method For Reducing Metal Oxide Powder And Attaching It To A Heat Transfer Surface And The Heat Transfer Surface
摘要 The purpose of the method developed is to form on top of a heat transfer surface a porous surface layer, which is to be fixed to the surface below it at a temperature and time applicable for industrial production. The heat transfer surface is copper or copper alloy. The powder forming a porous surface is fine-grained copper oxide powder, which is reduced to metallic copper on the heat transfer surface during heat treatment. The invention also relates to the heat transfer surface of copper or copper alloy, on which a porous layer has been formed from metallic copper, which is manufactured by reducing copper oxide powder and is attached using brazing solder.
申请公布号 US2007251410(A1) 申请公布日期 2007.11.01
申请号 US20050597155 申请日期 2005.06.01
申请人 RISSANEN PETRI;LAAKSONEN OLLI 发明人 RISSANEN PETRI;LAAKSONEN OLLI
分类号 B05D3/00;B22F7/00;B23K1/00;B23K1/008;B23K1/08;B23K1/19;B23K35/28;B23K35/30;C23C;C23C24/08;C23C24/10;C23C26/00;F28F13/18 主分类号 B05D3/00
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