Printed circuit board for package and making method for the same,申请号KR20060029179-传众专利搜索

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法人/股东/高管

发明名称	Printed circuit board for package and making method for the same
摘要
申请公布号	KR100771675(B1)	申请公布日期	2007.11.01
申请号	KR20060029179	申请日期	2006.03.30
申请人		发明人
分类号	H05K1/02;H01L23/488	主分类号	H05K1/02
代理机构		代理人
主权项
地址

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