| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding tool for electronic component and a bonding apparatus for electronic component which can perform stable bonding with stable vibration, which can perform an exchange of adhesion sections easily and swiftly, and in which vibration property of the adhesion section is hard to change even if the exchange of the adhesion sections is performed. SOLUTION: The bonding tool makes a vibrator 17 placed on the side of a horn 15 long from side to side give the horn 15 longitudinal vibration. The horn 15 has tapered surfaces 15a gradually diminishing toward the center, and a tapering adhesion 30 is detachably mounted on the center by screws 39 or the like. Further, the horn 15 is stuck to a block 13 with four ribs 15b arranged symmetrically in plan view. The vibration of the vibrator 17 is transmitted through the horn 15 to the adhesion section 30, to bond an electronic component adhering to the adhesion section 30 to a substrate. COPYRIGHT: (C)2008,JPO&INPIT |
