发明名称 HEAT CONVEYANCE DEVICE AND LIQUID COOLING SYSTEM USING IT
摘要 PROBLEM TO BE SOLVED: To provide a heat conveyance device used for a heat conveyance means for the cooling of heat radiating electronic components, which exerts large air flow and high cooling capability with thin shape even in the condition of high ventilation resistance, and is low in noise. SOLUTION: High-speed air flow blasted out from a sirocco type impeller 4 reduces its speed smoothly and sufficiently in a diffuser 8 and a scroll casing 9, the dynamic pressure is made to be efficiently transformed to the static pressure with little performance degradation as a blower, the air flow becomes to be a flow with small burble enhancing the heat transfer in the air side, and by thinning the thickness between a second flow passage 6x and a first flow passage 7 by making a stator blade 6 be flat type circular arc, the heat of cooling water can be radiated to air with high fin efficiency. Moreover, since the blasted air flow does not collide as much as possible in the front edge 6a of the stator blade 6, the increase of the noise accompanying the collision flow within the diffuser 8 is suppressed, making it possible to make small as much as possible the size of the impeller 4 and lower the noise emitted from the heat conveyance device 1 in order to obtain a predetermined blast performance. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007287957(A) 申请公布日期 2007.11.01
申请号 JP20060114194 申请日期 2006.04.18
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KIDA TAKUMI;TANIGUCHI MITSUNORI
分类号 H05K7/20;F04D29/44;F04D29/58;F28D15/02;H01L23/467;H01L23/473 主分类号 H05K7/20
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