| 发明名称 |
DEVICES AND METHODS FOR MEASURING WAFER CHARACTERISTICS DURING SEMICONDUCTOR WAFER POLISHING |
| 摘要 |
<p>A system and method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an indwelling optical sensor, disposed within a polishing pad and data signals are wireless transmitted to a control system.</p> |
| 申请公布号 |
WO2007123663(A2) |
申请公布日期 |
2007.11.01 |
| 申请号 |
WO2007US07887 |
申请日期 |
2007.03.29 |
| 申请人 |
STRASBAUGH;BENASSI, ROBERT, D. |
发明人 |
BENASSI, ROBERT, D. |
| 分类号 |
H01L21/306;C23F1/00 |
主分类号 |
H01L21/306 |
| 代理机构 |
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代理人 |
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