发明名称 |
HYBRID WAFER-HOLDER |
摘要 |
Wafer-holding structures formed from thermosetting resins are disclosed for use in semiconductor processing including, for example, SIMOX wafer processing. At least a portion of the distal portion of the holder comprises graphite, thereby reducing wafer rotation during implantation while maintaining the desired overall thermal signature provided by the thermosetting resin. In one embodiment a pin is disclosed that is adapted to receive a wafer edge, and is coupled with a wafer holder assembly. The pin can be filled with a conductive material to provide an electrical pathway between the wafer and the wafer holder assembly, which can be coupled to a ground. This arrangement provides a conductive path for inhibiting electrical discharges from the wafer during the ion implantation process. The pin exhibits thermal isolation characteristics and sufficient hardness so as to not effect localized thermal dissipation of the wafer, yet is sufficiently soft so as to not mark or otherwise damage the wafer.
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申请公布号 |
WO2007100873(A9) |
申请公布日期 |
2007.11.01 |
申请号 |
WO2007US05201 |
申请日期 |
2007.02.28 |
申请人 |
IBIS TECHNOLOGY CORPORATION;LEAVITT, WILLIAM;RICHARDS, STEVEN |
发明人 |
LEAVITT, WILLIAM;RICHARDS, STEVEN |
分类号 |
C23C14/50;C23C14/56;H01J37/20;H01L21/00;H01L21/68;H01L21/687 |
主分类号 |
C23C14/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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