| 摘要 |
PROBLEM TO BE SOLVED: To provide a strip format of a semiconductor package in which the number of strip formats mounted on a panel is increased and connection relation between the strip formats is further improved. SOLUTION: The strip format 100 comprises a package region 110 on which a semiconductor element is mounted to form an outer layer circuit pattern, and a dummy region 120 formed to enclose the package region. In the dummy region on one side surface, a trapezoidal projection 130 and a curved part 140, cut out in trapezoid, are continuously formed. In the dummy region on the other side surface, a curved part 150, being cutout in trapezoid, is formed at the part corresponding to the trapezoidal projection 130, and a trapezoidal projection 160 is formed at the part corresponding to the curved part 140 cut out in trapezoid. COPYRIGHT: (C)2008,JPO&INPIT |
