发明名称 PHOTOCURABLE RESIN COMPOSITION WITH EXCELLENT THERMAL CONDUCTIVITY
摘要 PROBLEM TO BE SOLVED: To provide a versatile photocurable resin composition usable for production of organic light emitting diode (OLED), liquid crystal display (LCD) and flexible display, etc., by improving heat conductivity and barrier performance to steam. SOLUTION: The photocurable resin composition comprises (a) 100 pts.wt. of an epoxy resin, (b) 0.01-20 pts.wt. of a photopolymerization initiator, (c) 0.01-10 pts.wt. of a coupling agent, (d) 0.01-120 pts.wt. of an inorganic filler and (e) 0.05-10 pts.wt. of a photo acid generating agent. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007284680(A) 申请公布日期 2007.11.01
申请号 JP20070108866 申请日期 2007.04.18
申请人 DONGJIN SEMICHEM CO LTD 发明人 SON JUNG HYUN;PARK JONG DAI;AHN IN SEOK
分类号 C08L63/00;C08G59/20;C08G59/68;C08K3/00 主分类号 C08L63/00
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