发明名称 Airflow guides using silicon walls/creating channels for heat control
摘要 An electronic device includes a printed circuit board having a wall deposited directly on a board serving as a base for a printed circuit. As the board is constructed, the wall is deposited on the board for controlling airflow. The wall controls airflow across the board and around components mounted to the board. The wall may be utilized for controlling airflow in combination with a second printed circuit board positioned adjacent to the first printed circuit board. The wall may be utilized for controlling various types of airflow, including airflow from sources including fans and convection, and from geometries including horizontal and vertical mounting geometries. The silicon wall may be utilized for preventing heat airflow generated by heat radiated from one component from impinging upon another component.
申请公布号 US2007253170(A1) 申请公布日期 2007.11.01
申请号 US20060412380 申请日期 2006.04.27
申请人 SLAGLE RICHARD A 发明人 SLAGLE RICHARD A.
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
主权项
地址