发明名称 Mounting device for a sputter source
摘要 <p>Sputtering target can be subdivided into exchangeable target segments (9), each contains coating material and each target segment border on >=2 adjacent target segments. Each target segment can be connected to a base body (13, 15) by securing mechanism (7, 10). The securing mechanism and the target segment have an intermediate space in which an electrically and thermally conductive mechanism (6, 10) is arranged, so that a uniform current strength can be distributed over the surface of the target segment. The heat arising on the target segment can be dissipated uniformly into the base body. Independent claims are included for: (1) coating source for a gas flow sputtering method; and (2) method for the coating of a component including sputtering source, the target and a gas for the transport of sputtered coating material to the component, comprising contacting gas with the target surface, releasing particles from the target surface, transporting the released particles with the flow of gas, the coating of the component with particles from the flow of gas. The flow of gas proportionally releases the particles of the component to be coated from each target segment. The conductive mechanism includes a contact lamella. The securing mechanism includes a plug connection, which is provided for target segments. The base body includes a cooling body onto which each target segment can be coupled.</p>
申请公布号 EP1849887(A1) 申请公布日期 2007.10.31
申请号 EP20070105115 申请日期 2007.03.28
申请人 SULZER METCO AG 发明人 BEELE, WOLFRAM;ESCHENDORFF, GERALD
分类号 C23C14/34 主分类号 C23C14/34
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