Smart card module for data storage used in payment purposes, has encapsulation covering chip contacting conductor structures on top surface of substrate

摘要

The module has contact arrays (4) arranged on a bottom surface (3) of a substrate (1) where the dimensions of the contact arrays conform to ISOstandard. Conductor structures (5) arranged on a top surface (2) of the substrate are connected to the contact arrays, which have through paths (6) in cutouts in the substrate. A chip (8) electrically conductively contacts the conductor structures. An encapsulation (10) covers the chip and a portion of the conductor structures and the top surface of the substrate.