发明名称 |
Elektrisches Bauelement und Verfahren zu dessen Herstellung |
摘要 |
A chip-type electronic component is provided in which generation of cracks in a glass coating layer and degradation of the insulating resistance in the ceramic body is unlikely to occur. In addition, a manufacturing method therefor is also provided. In the glass coating layer described above, the ratio of the alkali metal content to the silicon content is gradually increased from the vicinity of the glass coating layer to the inside thereof. The component is formed by forming a glass coating layer on surfaces of the component, in which the ratio of the alkali metal to the silicon in the glass coating layer is 0.3 or more; and a subsequent step of dipping the component provided with the glass coating layer in an acidic aqueous solution. |
申请公布号 |
DE10135319(B4) |
申请公布日期 |
2007.10.31 |
申请号 |
DE2001135319 |
申请日期 |
2001.07.19 |
申请人 |
MURATA MFG. CO. LTD. |
发明人 |
KISHIMOTO, ATSUSHI;KODAMA, MASAHIRO;NIIMI, HIDEAKI |
分类号 |
H01G4/12;H01G4/224;H01C1/034;H01F27/02;H01G2/10;H01G2/12;H01G4/06;H01G4/30;H01G7/00;H01L23/29;H01L37/00 |
主分类号 |
H01G4/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|