发明名称 Reduced package volume convectively cooled sealed electrical system and method
摘要 <p>A sealed modular control and monitoring system is provided which affords location of electrical control and monitoring components adjacent to an application. The system comprises modular components which are mounted on a shared thermal base. The base is sealed to the components and presents thermal exchange features on interior and exterior surfaces thereof. Forced convection within the modular system is afforded by a circulating fan that directs air through the component circuitry and adjacent to the thermal base to remove heat from the circuitry during operation. </p>
申请公布号 EP1509074(A3) 申请公布日期 2007.10.31
申请号 EP20040016533 申请日期 2004.07.14
申请人 ROCKWELL AUTOMATION TECHNOLOGIES, INC. 发明人 PLEMMONS, ROGER ALAN;NAIVA, MATHEW WILBUR;BLAKELY, JOHN HERMAN
分类号 H05K7/20;H05K7/14 主分类号 H05K7/20
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