| 摘要 |
<p>In a conventional wave soldering bath, molten solder spouted from a second discharge nozzle did not have a uniform height, oxides were spouted from the nozzle opening and adhered to printed circuit boards, and constituent parts of the wave soldering bath were eroded. In a wave soldering bath according to the present invention, a cylinder is disposed at one end of a duct, a spiral pump is installed in the cylinder, and the width of a nozzle opening is made narrower than the width of the duct.</p> |
