发明名称 A METHOD FOR MANUFACTURING KEY PAD STRUCTURE
摘要 A method for manufacturing a key pad structure is provided to clearly remove contaminant using water even if the surface of the key pad is contaminated. A key pad structure is provided on the upper portion of a circuit board of a wireless terminal including a plurality of switches and a backlight. An unevenness member(31) is formed on a top surface of a transparent synthetic resin sheet(30) through etching. A print layer(60) is formed on the bottom surface of the synthetic resin(30) through a deposition scheme or a screen printing scheme such that the print layer(60) has the bottom surface, through which light does not pass, and a font through which light passes. A pad having permeability is bonded to the print layer by a predetermined thickness while a protrusion is being formed at a position corresponding to a switch.
申请公布号 KR20070105774(A) 申请公布日期 2007.10.31
申请号 KR20060038361 申请日期 2006.04.27
申请人 I MOLD TECH CO., LTD. 发明人 MOON, IN SIK
分类号 H04M1/23 主分类号 H04M1/23
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