| 发明名称 |
HEAT SOFTENING THERMALLY CONDUCTIVE COMPOSITIONS AND METHODS FOR THEIR PREPARATION |
| 摘要 |
A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature. |
| 申请公布号 |
EP1559114(B1) |
申请公布日期 |
2007.10.31 |
| 申请号 |
EP20030809518 |
申请日期 |
2003.09.08 |
| 申请人 |
DOW CORNING CORPORATION |
发明人 |
BHAGWAGAR, DORAB, EDUL |
| 分类号 |
H01B1/20;C08K3/00;C08K3/04;C08K3/08;C08K5/04;C08K5/053;C08K5/09;C08K5/54;C08K9/02;C08L83/04;C09D5/24;C09D5/25;C09D183/04;C09J5/02;H01B1/22;H01B1/24;H01C1/084;H01C7/02 |
主分类号 |
H01B1/20 |
| 代理机构 |
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代理人 |
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