发明名称 |
Belaganordnung für thermische Zwischenlage mit niedrigschmelzendem Metall mit Halterungsmatrix |
摘要 |
A stabilized thermally conductive mechanical compliant laminate pad to be interposed between opposed surfaces of a generating semi-conductor device and a heat sink, with the laminate pad comprising upper and lower laminae on opposed surfaces of a central stabilizing apertured grid. The laminae are subjected to a compressive force at an elevated temperature until portions of the laminae extend through the apertures to form a continuum. The laminae comprise a polymer matrix having a quantity of a low melting indium or gallium alloy and a thermally conductive particulate dispersed there through, with the polymer matrix being a hot wax or melt resin. With the upper and lower laminae positioned on opposed surfaces of a central stabilizing apertured grid a compressive load is applied to force portions of said laminae to pass through apertures in the mesh grid to form a continuum. <IMAGE> |
申请公布号 |
DE60311936(T2) |
申请公布日期 |
2007.10.31 |
申请号 |
DE2003611936T |
申请日期 |
2003.09.10 |
申请人 |
THE BERGQUIST COMPANY |
发明人 |
MISRA, SANJAY;JEWRAM, RADESH;ELAHEE, GM FAZLEY |
分类号 |
C08K3/00;H01L23/373;C08K3/08;C08L101/00;H01L23/36;H01L23/433 |
主分类号 |
C08K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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