SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING APPARATUS

摘要

A substrate processing method is provided to enable adjustment of an exposure position with respect to a dummy substrate having no contaminants on its back surface by cleaning the back surface of a dummy substrate transferred to a substrate processing apparatus and by transferring the dummy substrate having a cleaned back surface to an exposure apparatus. A dummy substrate for adjusting the exposure position of a pattern shape in an exposure apparatus is transferred to a substrate processing apparatus(S1). The dummy substrate is reversed in the substrate processing apparatus so that the back surface of the dummy substrate becomes an upper surface(S2). The back surface of the dummy substrate is cleaned in the substrate processing apparatus(S3). The dummy substrate is reversed so that the back surface of the dummy substrate becomes a bottom surface(S4). The cleaning process can be performed immediately before and/or after the exposure position is adjusted. The cleaning process can be carried out periodically.