DUAL EVAPORATION SPUTTERING SIMULTANEOUS DEPOSITION APPARATUS

摘要

An evaporation sputtering simultaneous deposition apparatus is provided to minimize influence between inert gas and evaporation gas by forming an evaporation path and an inert gas supply path separately. An evaporation sputtering simultaneous deposition apparatus includes a reaction chamber(10), a sputtering unit(100), an evaporation unit(200), a gas supply, and a filter(330). A substrate is provided inside the reaction chamber. The sputtering unit deposits metal material on the substrate. The evaporation unit evaporates and sprays the metal material on the substrate and is located apart from the gas supply. The gas supply provides the reaction chamber with inert gas for sputtering the metal material charged in the sputtering unit. The filter filters the inert gas using a reaction agent.