发明名称 |
APPARATUS AND METHOD FOR REDUCING SUBSTRATE WARPAGE |
摘要 |
<p>The invention provides an apparatus and method for reducing warpage of a substrate undergoing a molding process, comprising a conveying device for transporting the substrate during molding and pressure means adapted to act on the substrate whereby to maintain the flatness of the substrate. Using the invention, it is possible to provide an apparatus and method which are usable with conventional substrates and which reduce reliance on material formulation to maintain flatness of the substrate.</p> |
申请公布号 |
SG135970(A1) |
申请公布日期 |
2007.10.29 |
申请号 |
SG20060000467 |
申请日期 |
2003.10.15 |
申请人 |
ASM TECHNOLOGY SINGAPORE PTE LTD |
发明人 |
CHUEN HO SHU;HOCK KUAH TENG;WEE KOCK HIEN, EUGENE;JIAN WU |
分类号 |
H01L21/687;(IPC1-7):B29C45/14;H01L21/56 |
主分类号 |
H01L21/687 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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