COMPONENTS HAVING A FILM STRUCTURE AND METHODS OF FORMING COMPONENTS HAVING A FILM STRUCTURE

摘要

A method of forming a component having a film structure comprises thermally oxidising a first layer of a silicon substrate to form a compressive thermal oxidization silicon dioxide layer; and applying a layer comprising a nickel-titanium alloy to the first layer such that the first layer is located between the layer comprising a nickel- titanium alloy and the substrate. There is also disclosed a method of forming a component having a film structure comprising applying a first layer to a substrate to form an adhesive layer and applying a layer comprising a nickel-titanium alloy to the first layer such that the first layer is located between the layer comprising a nickel-titanium alloy and the substrate. There is further disclosed a component formed according to these methods and MEMS devices formed according to these methods.