| 摘要 |
A sealing structure of the thermoelectric conversion device, which has high sealing capability and is easy to manufacture, is provided. A thermoelectric conversion circuit utilizing Peltier effect is interposed between two metal heat exchanger plates. The O-ring interposed between the outer edge portions of the heat exchanger plates seals the gap formed between the outer edge portions of the heat exchanger plates along the whole periphery. The connector for connecting the thermoelectric conversion circuit to the external power supply is inserted into the through hole formed on the heat exchanger plate. The O-ring fitted on the connector seals the gap between the connector and the through hole spontaneously, when the connector is inserted into the through hole. |
