| 摘要 |
A camera module package is provided to fix a via hole of a flexible printed circuit board to a bump of an image sensor by one to one matching directly, thereby improving degree of freedom in a circuit design of the flexible printed circuit board and releasing limitation of via hole punching space by reducing a size of the circuit board and the image sensor. A camera module package comprises the following: an image sensor(21) where multiple bumps are formed outside and a light accepting unit is installed in the middle part of an upper surface; a flexible printed circuit board(25) closely connected by a flip chip in the upper surface of the image sensor and have punched multiple via holes(27) to closely connect a joining part; and an optical unit which is composed of a housing mounted on the upper surface of the flexible printed circuit board and a lens barrel connected by a screw in the center of an upper part.
|
