| 摘要 |
A method for cutting tail wire of a bonding apparatus is provided to prevent bending of wire in cutting tail wire by cutting the tail wire without applying high tension to the tail wire. After a second bonding point(4) is bonded, a clamper(17) is opened to raise a capillary(16) together with the clamper from the second bonding point to a first height so that tail wire(8) is leaded to the front end of the capillary. The clamper is closed to reciprocate or shake the capillary together with the clamper in a shape of a circular arc on a curved surface whose top reaches the first height so that the hardness of a material between the tail wire and the second bonding point is lowered. The clamper can reciprocate in a direction of a line that connects the first bonding point to the second bonding point. The clamper is opened to raise the capillary together with the clamper from the first height to a second height so that the tail wire is further leaded to the front end of the capillary. The clamper is closed to raise the capillary together with the clamper from the second height, and the tail wire is cut from the second bonding point. |
