| 摘要 |
An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask ( 7 ) is formed on the bump formation side ( 3 a) of a metal foil ( 3 ) having a thickness (t 1 +t 2 ) equal to the sum of the thickness t 1 of a wiring circuit ( 1 ) and the height t 2 of the bumps ( 2 ) to be formed on a wiring circuit ( 1 ), the bumps ( 2 ) are formed by half-etching the metal foil ( 3 ) from the bump formation etching mask ( 7 ) side down to a depth corresponding to a predetermined bump height t 2, and a metal thin film layer ( 10 ) composed of a different metal from the metal foil ( 3 ) is formed on the bump formation side of the metal foil ( 3 ), thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. |
