RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND FABRICATING METHOD OF THE SAME

摘要

A rigid-flexible printed circuit board and a manufacturing method thereof are provided to reduce a manufacturing time and a manufacturing cost by reducing the entire thickness of the rigid-flexible printed circuit board due to using a polyimide-group bonding sheet as an insulation layer on an innerlayer circuit pattern. A rigid-flexible printed circuit board includes first and second CCLs(110a,110b), an insulation layer(116), a bonding sheet(120), and an outerlayer circuit pattern(112b). The first and second CCLs(Copper Clad Laminates) are formed, such that inner circuit patterns are arranged to face each other. The insulation layer is laminated on a rigid region between the first and second CCLs. The bonding sheet is made of a polyimide material and laminated on an innerlayer circuit pattern. The outerlayer circuit pattern is formed on the bonding sheet in the rigid region.