METHOD FOR PRINTING SOLDER PASTES USING A MASK AND A JIG USED THEREFOR

摘要

A method for printing a solder paste using a mask and a jig for printing the solder paste are provided to form reliably a solder ball by separating the mask from a substrate when a pattern portion of the mask is balanced. A mask, on which a hole of a predetermined pattern is formed, is arranged on a substrate(S110). A solder paste is filled in the hole of the mask by using a squeeze(S120). The mask is separated from the substrate(S130). The solder paste is cured on the substrate(S140). Plural jigs are fixed on predetermined positions from a plane of the mask. The mask is balanced by the jig when the mask is separated from the substrate.