| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device with high radiation property and reliability, which is applied to a large light emitting element. <P>SOLUTION: The light emitting element 2 is fixed onto the surface of a radiation member 3 via a sub-mount 4 with the use of blazing materials 5, 7. Grooves 6 are arranged in an area excluding the center of the plane area of the light emitting element 2 concerning the surface of the member 3. Stress is absorbed due to the deformation of the radiation member in the circumference of the grooves 6. <P>COPYRIGHT: (C)2008,JPO&INPIT |
