| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting device and the light emitting device capable of a miniaturization of a mounted device by making further thinner possible. <P>SOLUTION: A resist film 15 is arranged so as to seal a via hole 14 which is formed on a printed wiring board 1 having a connection electrode 11 at the both edges of an insulation board 10 and a wiring pattern 12 to which a wire bonding is carried out. A light emitting element 18 is mounted in a bottom of a recess 16 formed by the via hole 14 and the resist film 15. A connection wiring which connects the light emitting element 18 and the wiring pattern 12 with a wire 19 is carried out. A sealing part 20 is formed by sealing the light emitting element 18 with a resin. <P>COPYRIGHT: (C)2008,JPO&INPIT |
