发明名称 METHOD AND APPARATUS FOR SLICING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To sufficiently supply a slicing fluid to a processing point even in slicing a large-diameter ingot by reducing the cut amount of a blade into the ingot as much as possible. SOLUTION: The ingot S is rotatably held around a shaft. The ingot S is sliced in rounds by combining a cutting operation for allowing an external peripheral blade 230 having a rotary shaft (spindle shaft 221) arranged in parallel to the shaft direction of the ingot S to cut, so that the blade edge of the external blade 232 can reach the diameter center of the ingot S; and a rotary operation of rotating the ingot S at 180°or more. A cutting edge protruding quantity R of the external blade 230 can be made small to the degree equivalent to the radius of the ingot S. As a result, the cutting liquid can easily reach a processing point, and a large-diameter ingot can be cut without any trouble. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007281210(A) 申请公布日期 2007.10.25
申请号 JP20060105914 申请日期 2006.04.07
申请人 DISCO ABRASIVE SYST LTD 发明人 SEKIYA KAZUMA
分类号 H01L21/304;B24B27/06;B28D5/02 主分类号 H01L21/304
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