| 摘要 |
PROBLEM TO BE SOLVED: To solve both a problem of unintended mask film exfoliation due to desmear processing and a problem of binding agent and adhesive residues on a conductor after printing in the case of manufacturing a double-sided printed CCL wiring board. SOLUTION: In the case of manufacturing the double sided printed wiring board 30 wherein conductive paste for inter-layer conduction are filled in via-holes, when the mask film 14 is directly adhered to one side of a conductor layer 12 of a double sided board 10 with conductor layers 12, 13 whose circuits on both sides are not formed yet, and the via-holes 17, 18 are formed by using the mask film 14 for a print mask, an opening 16 whose diameter is greater than the diameter of the via-hole is opened to the mask film 14 by laser emission, the conductive paste 31 is filled into the via-holes 17, 18, and thereafter the filled conductive paste 31 is cured by thermal press curing and then the circuit for the conductor layers 12, 13 is formed. COPYRIGHT: (C)2008,JPO&INPIT |
