MOUNTING STRUCTURE OF ELECTRONIC PART, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To economize the conductive particles of conductive paste while obtaining the reliability of an electrical connection in a flip chip bonding previously coating a resin for an underfill. SOLUTION: A solder resist 3 exposing a pad 2 is formed on a wiring board 1 forming a wiring and the pad 2 at a specified place. The shape of the solder resist is formed in a cone shape while surrounding the pad 2. The upper section of the pad 2 for the wiring board is supplied with conductive paste 6 adding conductive particles 5 to the resin 4. Conductive particles 5 precipitate by gravity (a). The wiring board 1 is vibrated in the horizontal direction (b), and the conductive particles 5 slip down to a cone-shaped bottom from the flat section of the solder resist (c). A semiconductor chip 7 forming a bump 9 on an electrode 8 is loaded on the wiring board 1. The resin 4 is cured by a heating while applying a load to the semiconductor chip 7 (d). COPYRIGHT: (C)2008,JPO&INPIT