| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier object which can be improved in flatness of its recessed region and restraining or preventing a level difference or a height difference from occurring between itself and a thin substrate, to vary an application volume of solder and part mounting errors from occurring due to a variation in the application amount of solder, and to provide a method of manufacturing the same. SOLUTION: The carrier object is equipped with a carrier board 3 which is stacked on a positioning board 1 detachably and has a recessed region 35 which holds two or more flexible wiring boards 10, on which cream solder is applied by a squeegee in a detachable manner by adhesion. The carrier board 3 is composed of a rigid and flat base board 30 and a frame board 33 which is laminated and bonded on the surface of the base board 30, and the recessed region 35 is formed on the rectangular hollow part 34 of the frame board 33 by demarcation. The base board 30 and the frame board 33 are bonded together to form the recessed region 35 in the carrier board 3, so that the recessed region 35 can be improved in flatness. COPYRIGHT: (C)2008,JPO&INPIT
|
