| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component which actualizes lowering the height by excluding a substrate from the component of the electronic part. SOLUTION: With forming a predetermined coil pattern without using the substrate 2, lowering of the height of the electronic component and a miniaturization are actualized. When an electrode 110 of the shape of a three dimensional coil is formed in a resin 100 with a multi-layer, a side to which an outside of a coil-like wiring 110 is faced is aligned in the same plane by dicing device or the like, further is protected by the resin 100, the electronic part can be enhanced in L (inductance) and Q-value in spite of the miniaturization. COPYRIGHT: (C)2008,JPO&INPIT
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