发明名称 SURFACE TREATMENT AGENT FOR Sn AND Sn ALLOY
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment agent which can be applied to a component made of an acid-labile material, imparts oxidation resistance to Sn and an Sn alloy, and improves the solder wettability; and to provide a surface treatment agent which can suppress the occurrence of whisker of Sn and the Sn alloy. SOLUTION: The surface treatment agent for Sn and the Sn alloy comprises a tannic acid in an amount of≥0.01 g/L. In the case when a water-based solvent is used as a solvent, the pH of a solution is preferably adjusted to 3-5. Further, the tannic acid can be stabilized by the incorporation of an antioxidant. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007277593(A) 申请公布日期 2007.10.25
申请号 JP20060101609 申请日期 2006.04.03
申请人 NIKKO KINZOKU KK 发明人 OUCHI TAKASHI
分类号 C23C22/58;B23K1/00;B23K1/20;B23K101/42;C25D5/48;C25D7/00;H05K3/24;H05K3/34 主分类号 C23C22/58
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