| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component in which flexure or breaking hardly occur on a bonded substrate, and thermal damage is small on an element formed on the substrate. SOLUTION: An elastic bulk wave device 10 being the electronic component includes a first substrate 12 comprised of Si and a second substrate 22 comprised of a glass substrate. An elastic bulk wave element 14 is formed on one major surface of the first substrate 12. First electrodes for bonding 20a, 20b, 20c comprised of Sn are formed on one major surface side of the first substrate 12. Second electrodes for bonding 28a, 28b, 28c comprised of Au are formed on one major surface side of the second substrate 22. A laser is applied from the other major surface side of the second substrate 22 so that the first electrodes for bonding 20a, 20b, 20c and the second electrodes for bonding 28a, 28b, 28c are melt and bonded. Accordingly, bonded parts 30a, 30b, 30c are formed. COPYRIGHT: (C)2008,JPO&INPIT
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