发明名称 SUBSTRATE DIVIDING METHOD, INK JET RECORDING HEAD AND ITS MANUFACTURING METHOD, AND INK JET RECORDER
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a substrate dividing method for dividing a substrate by reliably irradiating the substrate with a laser beam after adhesion, an ink jet recording head and its manufacturing method, and an ink jet recorder. <P>SOLUTION: A first groove 35 is formed in the vicinity of an outer periphery of a first substrate 34, and the first substrate 34 is coated with an adhesive 36 and adhered to a second substrate 37. In a state the adhesive 36 flows in the first groove 35 to form an adhesive pool and does not flow out of the outer periphery of the first substrate 34, the second substrate 37 in the vicinity of the outer periphery of the first substrate 34 is irradiated with laser beams 39 in a condensing manner to form a modified part 40. The second substrate 37 is placed on a division table 42, and the modified part 40 is pressed and divided by a pressurization unit 43. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007275966(A) 申请公布日期 2007.10.25
申请号 JP20060108346 申请日期 2006.04.11
申请人 SEIKO EPSON CORP 发明人 YAMAZAKI YUTAKA;UMETSU KAZUNARI
分类号 B23K26/38;B23K26/36;B23K26/40;B28D5/00;B41J2/045;B41J2/055;B41J2/16 主分类号 B23K26/38
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