HIGHLY HEAT-CONDUCTIVE RESIN COMPOUND, HIGHLY HEAT-CONDUCTIVE RESIN MOLDED ARTICLE, COMPOUNDING PARTICLE FOR HEAT-RELEASING SHEET, HIGHLY HEAT-CONDUCTIVE RESIN COMPOUND, HIGHLY HEAT-CONDUCTIVE RESIN MOLDED ARTICLE, HEAT-RELEASING SHEET, AND METHOD FOR PRODUCING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a highly heat-conductive resin compound capable of producing heat-releasing sheets which can prevent the roughening of surfaces, even when large particles exceeding 80μm are used, hardly drop the particles from cut faces, and furthermore improve heat conductivity, to provide a highly heat-conductive resin molded article, to provide compounding particles for heat-releasing sheets, to provide a highly heat-conductive resin compound, to provide a highly heat-conductive resin molded article, to provide a heat-releasing sheet, and to provide a method for producing the same. SOLUTION: The highly heat-conductive resin compound, the highly heat-conductive resin molded article, the compounding particles for heat-releasing sheets, the highly heat-conductive resin compound, the highly heat-conductive resin molded article, the heat-releasing sheet, and the method for producing the same, are each characterized by containing 60 to 80 vol.% of spherical alumina particles having an average particle diameter of 80 to 100μm and 20 to 40 vol.% of alumina particles having an average particle diameter of 0.5 to 7μm. COPYRIGHT: (C)2008,JPO&INPIT