| 摘要 |
A method of manufacturing a device includes the steps of (i) providing a near-field photomask including a light shield film for constituting a light shield portion and openings formed in the light shield film, wherein the openings include two or more parallel first slit openings lengthening in a first direction and a second slit opening lengthening in a second direction that is perpendicular to the first directions, wherein the second slit opening interlinks the first slit openings, (ii) forming a photoresist layer on a substrate, (iii) exposing the photoresist layer to near-field light through the near-field photomask using polarized exposure light having an electrical field component parallel to the first direction, to form a latent image on the photoresist only in discrete regions at which the second slit opening crosses the light shield portion, (iii) forming a pattern of the photoresist layer based on the latent image, and (iv) etching a surface of the substrate based on the pattern.
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