HIGH FREQUENCY MODULE USING METAL-WALL AND METHOD OF MANUFACTURING THE SAME

摘要

A high frequency module and a manufacturing method thereof In the module, a substrate has a ground. A plurality of surface mounted devices are mounted on the substrate. A metal wall is connected to the ground of the substrate. A resin molding hermetically seals the surface mounted devices and the metal wall, the resin molding formed to expose a top surface of the metal wall. Also, a metal film is formed on the resin molding to contact the top surface of the exposed metal wall.