| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a process for manufacturing a piezoelectric device in which a piezoelectric vibration chip can be separated with good profile, product quality can be improved by enhancing mount precision, and manufacturing cost can be reduced. <P>SOLUTION: The process for manufacturing a piezoelectric device comprises a step for forming a fragile layer at the joint 4 of a frame 2 and an element piece 40-1 by irradiating the joint 4 with femtosecond laser, and a step for dividing the frame 2 and the element piece 40-1 at the joint 4. <P>COPYRIGHT: (C)2008,JPO&INPIT |
