| 摘要 |
PROBLEM TO BE SOLVED: To attain securely reflow soldering of a component mounting substrate and the like so as not to deteriorate the whole manufacturing efficiency, in mixed flow manufacturing. SOLUTION: This heating method is carried out such that two or more workpieces (substrate 22) having different heat capacity are heated for reflow-soldering within common uniform temperature atmosphere (these heating zones Z1-Z6). In this case, the heating method comprises: a first process for classifying the two or more workpieces to be heated into a first group which is subjected to auxiliary heating in the atmosphere (auxiliary heating zone Z0) of a temperature (auxiliary heating temperature) lower than the temperature (the main heating temperature) of a uniform temperature atmosphere, and a second group which is not subjected to auxiliary heating, based on the difference in calorific capacity; a second process for performing auxiliary heating to the workpiece belonging to the first group and raising the start temperature and then performing the main heating from the raised start temperature; and a third process which does not perform auxiliary heating to the workpiece belonging to the second group, but performs this main heating. COPYRIGHT: (C)2008,JPO&INPIT
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